Vertex
Vertex is a hugely versatile vertical technology manufactured with PTSL custom geometries and homogenous materials for maximum reliability
Capabilities overview:
Bond Pad, Bump / Pillar applications
Single-site & Multi-site applications
High Density Flip Chip/Bump Area Arrays
Peripheral-Plus Applications
- Applications with Peripheral Bond Pads & Pads in the Center of the Array
Supports High Current Carrying Requirements
Interposer Option:
Wired ST
Direct Attach
MLO/MLC
PII (PTSL Integrated Interposer)
Proprietary board-on-board technology that enhances signal integrity while reducing cycle time and cost.
How it works:
- Moves manufacturing challenges from high aspect ratio single PCB to low aspect ratio daughter card
- Multiple daughter cards on 1 panel.
- Minimises potential yield loss on lower complexity main PCB.
- Tight pitch daughter cards can be tested and verified prior to final bond to the main PCB thus increasing overall yield.